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High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

Brand Name:	Customized
MOQ:	1 painel
preço:	Negociável
Payment Terms:	T/T

Detail Information

Descrição do produto

Detail Information

Place of Origin:

China

Certificação:

ISO9001, ISO13485,IS014001

Tipo de placa:

6 camadas

Material Básico:

FR4/ROGERS/Alta Tg

Máscara de solda:

Máscara de solda verde

Ponte mínima da máscara de solda:

0,1mm

Acabamento de superfície:

EING

Tipo de serviço:

Protótipo de PCB/produção em massa

Tamanho:

Personalizado

Espessura de Cu:

1oz

Tamanho máximo do substrato:

24×32

Detalhes da embalagem:

Pacote a vácuo

Destacar:

HDI PCB prototype service

high density interconnect PCB production

printed circuit board mass production

Descrição do produto

Product Description:

The HDI PCB is a high density interconnect printed circuit board designed to meet the demanding requirements of modern electronic applications. With its advanced manufacturing techniques and superior material choices, this product ensures exceptional performance, reliability, and precision in complex circuit designs. The HDI PCB features an impressive minimum line space of 0.075mm, allowing for extremely fine circuit patterns that support miniaturization and high functionality in compact spaces. This capability makes it an ideal solution for cutting-edge electronics where space savings and high circuit density are critical.

HDI PCB Design DFM Requirements

Normally, DFM requirements relating to clearances in HDI PCB are quite strict, but it can be come tured by taking advantage of your design rules in your PCB design software. Some of the important DFM requirements to gather before layout and routing include:

Circuit width and spacing limits
Annular ring and aspect ratio limits, especially for high reliability designs and requirements
Material choice used in the board to ensure impedance control in the required stackup
Impedance profiles for the desired stackup or layer pairs if available
Blind vias connect exterior layer to at least one interior layer without penetrating the entire board.
Buried vias connect one or more inner layers together without any connections to the exterior layers of a board.
Any layer HDI refers to the use of stacked copper-filled microvias to connect multiple layers in a PCB.

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type 0

Etiquetas:

Placa flexível do PWB

PWB rígido

PWB de cobre

Rígida Flex PCB

Placa de alumínio do PWB

PWB do hdi

PWB pesado do cobre

Rogers pcb

Placa do PWB do diodo emissor de luz

Conjunto de PCB de energia

Enrolamento do PWB

PWB rápido da volta

PWB de alta frequência

Conjunto do PWB do EMS

Placa flexível do PWB

PWB rígido

PWB de cobre

Rígida Flex PCB

Placa de alumínio do PWB

PWB do hdi

PWB pesado do cobre

Rogers pcb

Placa do PWB do diodo emissor de luz

Conjunto de PCB de energia

Enrolamento do PWB

PWB rápido da volta

PWB de alta frequência

Conjunto do PWB do EMS

products details

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

HDI PCB prototype service

high density interconnect PCB production

printed circuit board mass production

Product Description:

HDI PCB Design DFM Requirements